Memory device configuration commands

ABSTRACT

Apparatuses and methods for configuring a memory device using configuration commands are provided. One example method can include executing a first command while the memory device is in a ready state to configure the memory device to a particular mode and executing a second command to perform a first operation while the memory device is in the particular mode.

PRIORITY APPLICATION

This application is a Continuation of U.S. application Ser. No.15/939,459, filed Mar. 29, 2018, which is a Continuation of U.S.application Ser. No. 15/264,888, filed Sep. 14, 2016, which issued asU.S. Pat. No. 9,940,052 on Apr. 10, 2018, the contents of which areincluded herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to memory devices, and moreparticularly, to apparatuses and methods for configuring a memory deviceusing configuration commands.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic devices. There aremany different types of memory including volatile and non-volatilememory. Volatile memory can require power to maintain its data andincludes random-access memory (RAM), dynamic random access memory(DRAM), and synchronous dynamic random access memory (SDRAM), amongothers. Non-volatile memory can provide persistent data by retainingstored data when not powered and can include NAND flash memory, NORflash memory, read only memory (ROM), Electrically Erasable ProgrammableROM (EEPROM), Erasable Programmable ROM (EPROM), and resistance variablememory such as phase change random access memory (PCRAIVI), resistiverandom access memory (RRAM), and magnetoresistive random access memory(MRAM), among others.

Memory devices can be combined together to form a storage volume of amemory system such as a solid state drive (SSD). A solid state drive caninclude non-volatile memory (e.g., NAND flash memory and NOR flashmemory), and/or can include volatile memory (e.g., DRAM and SRAM), amongvarious other types of non-volatile and volatile memory.

An SSD can be used to replace hard disk drives as the main storagevolume for a computer, as the solid state drive can have advantages overhard drives in terms of performance, size, weight, ruggedness, operatingtemperature range, and power consumption. For example, SSDs can havesuperior performance when compared to magnetic disk drives due to theirlack of moving parts, which may avoid seek time, latency, and otherelectro-mechanical delays associated with magnetic disk drives.

Memory is also utilized as volatile and non-volatile data storage for awide range of electronic applications. Non-volatile memory may be usedin, for example, personal computers, portable memory sticks, digitalcameras, cellular telephones, portable music players such as MP3players, movie players, and other electronic devices. Memory cells canbe arranged into arrays, with the arrays being used in memory devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an apparatus in the form of a computingsystem including a memory system in accordance with a number ofembodiments of the present disclosure.

FIG. 2 is a schematic of a portion of memory comprising an array ofmemory cells operable in accordance with a number of embodiments of thepresent disclosure.

FIGS. 3A-3C illustrate timing diagrams using configuration commands inaccordance with one or more embodiments of the present disclosure.

FIGS. 4 is a table illustrating configuration commands in accordancewith a number of embodiments of the present disclosure.

DETAILED DESCRIPTION

Apparatuses and methods for configuring a memory device usingconfiguration commands are provided. One example method can includeexecuting a first command while the memory device is in a ready state toconfigure the memory device to a particular mode and executing a secondcommand to perform a first operation while the memory device is in theparticular mode.

In a number of embodiments, a number of configuration commands can beused to cause memory devices to operate in a number of modes. Forexample, a memory device can be configured to operate single level cell(SLC) mode, in which each cell is programmable to one of two states,storing one bit of information per cell. A memory device can also beconfigured to operate in a multi-level cell (MLC) mode, in which eachcell is programmable to one of a number of states, storing one or morebits of information per cell. As an example, the memory device can beconfigured to operate in a 2-bit per cell MLC mode or in a 3-bit percell MLC mode.

In one or more embodiments of the present disclosure, a number ofconfiguration commands can be used to place the memory device in one ofa number of modes indicated by the configurations commands. Theconfiguration commands can be issued by a host and executed by thememory device to place the memory device in a particular configuration.For example, the configuration commands can cause the memory device tooperate as a SLC device or as an MLC device. The configuration commandscan designate the particular number of bits stored per cell (e.g., 1, 2,or 3, etc.). The configuration commands can cause the memory device toprogram the memory cells in accordance with a particular programmingalgorithm (e.g., course, fine, or superfine), which can indicate thequantity of programming signals used to place the memory cell in adesired state, for example.

The number of configuration commands can be issued and executed whilethe memory device is in a ready state and the host and/or memory devicedo not use a command queue for execution of the configuration commands,therefore there is not a data input phase that would use bus bandwidthbetween a memory system and a host. In previous approaches, a setfeature and/or a multi-level block instruction was used to configure amemory device, which required the host and/or memory device to use acommand queue, transfer data on the bus between the memory device andthe host, and execution of the instructions caused the memory device tobe in a busy state.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how a number of embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure. As used herein, the designator “N” indicatesthat a number of the particular feature so designated can be includedwith a number of embodiments of the present disclosure.

As used herein, “a number of” something can refer to one or more of suchthings. For example, a number of memory devices can refer to one or morememory devices. Additionally, designators such as “N”, as used herein,particularly with respect to reference numerals in the drawings,indicates that a number of the particular feature so designated can beincluded with a number of embodiments of the present disclosure.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. As will be appreciated,elements shown in the various embodiments herein can be added,exchanged, and/or eliminated so as to provide a number of additionalembodiments of the present disclosure. In addition, the proportion andthe relative scale of the elements provided in the figures are intendedto illustrate various embodiments of the present disclosure and are notto be used in a limiting sense.

FIG. 1 is a functional block diagram of an apparatus in the form of acomputing system 100 including at least one memory system 104 inaccordance with one or more embodiments of the present disclosure. Asused herein, an “apparatus” can refer to, but is not limited to, avariety of structures or combinations of structures, such as a circuitor circuitry, a die or dice, a module or modules, a device or devices,or a system or systems, for example. In the embodiment illustrated inFIG. 1, the memory system 104 can include a controller 108 and one ormore memory devices 110-1, . . . , 110-N. In this example, thecontroller 108 is external to the one or more memory devices 110-1, . .. , 110-N. The memory devices 110-1, . . . , 110-N can provide a storagevolume for the memory system (e.g., with a file system formatted to thememory devices). In a number of embodiments, the number of memorydevices 110-1, . . . , 110-N can include non-volatile memory including anumber of logical units (LUNs). A LUN can be a portion of non-volatilememory that can be independently controllable. The controller 108 caninclude control circuitry (e.g., hardware, firmware, and/or software).In one or more embodiments, the controller 108 can be an applicationspecific integrated circuit (ASIC) coupled to a printed circuit boardincluding a physical interface and memory devices 110-1, . . . , 110-N.Also, the controller can include volatile and/or non-volatile memory.

As illustrated in FIG. 1, a host 102 can be coupled to the memory system104. Host 102 can be a laptop computer, personal computers, digitalcamera, digital recording and playback device, mobile telephone, PDA,memory card reader, interface hub, among other host systems, and caninclude a memory access device (e.g., a processor). One of ordinaryskill in the art will appreciate that “a processor” can intend one ormore processors, such as a parallel processing system, a number ofcoprocessors, etc.

In one or more embodiments, a physical host interface can be in the formof a standardized interface. For example, when the memory system 104 isused for data storage in a computing system 100, a physical hostinterface can be a serial advanced technology attachment (SATA),peripheral component interconnect express (PCIe), or a universal serialbus (USB), among other connectors and interfaces. In general, however, aphysical host interface can provide an interface for passing control,address, data, and other signals between the memory system 104 and ahost 102 having compatible receptors for the physical host interface.

The controller 108 can communicate with the memory devices 110-1, . . ., 110-N to read, write, and erase data, among other operations.Controller 108 can have circuitry that may be one or more integratedcircuits and/or discrete components. A controller could selectivelycouple an I/O connection (not shown in FIG. 1) of a memory device 110-1,. . . , 110-N to receive the appropriate signal at the appropriate I/Oconnection at the appropriate time. Similarly, the communicationprotocol between a host 102 and the memory system 104 may be differentthan what is required for access of a memory device 110-1, . . . ,110-N. Controller 108 can translate the commands received from a hostinto the appropriate commands to achieve the desired access to a memorydevice 110-1, . . . , 110-N.

In a number of embodiments, a number of configuration commands can beused to cause memory devices to operate in a number of modes. A numberof commands, such as commands 40h, 41h, 42h, 43h, 44h, 45h, and 46h,described below in association with FIGS. 3A-4, can be used to configurea memory device to operate single level cell (SLC) mode, in which eachcell is programmable to one of two states, storing one bit ofinformation per cell or in a multi-level cell (MLC) mode, in which eachcell is programmable to one of a number of states, storing one or morebits of information per cell. The configuration commands can be used toconfigure a memory device to operate with a particular number of bitsstored in each cell when the device is configured to operate as amulti-level cell. The configuration commands can be used to configure amemory device to program the memory cells using a particular programmingalgorithm.

A memory device 110-1, . . . , 110-N can include one or more arrays ofmemory cells (e.g., non-volatile memory cells). The arrays can be flasharrays with a NAND architecture, for example. Embodiments are notlimited to a particular type of memory device. For instance, the memorydevice can include volatile and/or non-volatile memory, such as flashmemory, resistance variable memory, and/or DRAM, among others.

The memory devices 110-1, . . . , 110-N can include a number of memorycells that can be grouped. As used herein, a group can include one ormore memory cells, such as a page, block, plane, die, an entire array,or other groups of memory cells. For example, some memory arrays caninclude a number of pages of memory cells that make up a block of memorycells. A number of blocks can be included in a plane of memory cells. Anumber of planes of memory cells can be included on a die. As anexample, a 128 GB memory device can include 4314 bytes of data per page,128 pages per block, 2048 blocks per plane, and 16 planes per device.

In a memory device, a physical page can refer to a unit of writingand/or reading (e.g., a number of cells that are written and/or readtogether or as a functional group of memory cells). An even page and anodd page can be written and/or read with separate writing and/or readingoperations. For embodiments including multilevel cells (MLC), a physicalpage can be logically divided into, for example, an upper page and alower page of data. For example, one memory cell can contribute one ormore bits to an upper page of data and one or more bits to a lower pageof data. Accordingly, an upper page and a lower page of data can bewritten and/or read as part of one writing and/or reading operation, asthe logical upper page and logical lower page are both part of the samephysical page.

The embodiment of FIG. 1 can include additional circuitry that is notillustrated so as not to obscure embodiments of the present disclosure.For example, the memory system 104 can include address circuitry tolatch address signals provided over I/O connections through I/Ocircuitry. Address signals can be received and decoded by a row decoderand a column decoder to access the memory devices 110-1, . . . , 110-N.It will be appreciated by those skilled in the art that the number ofaddress input connections can depend on the density and architecture ofthe memory devices 110-1, . . . , 110-N.

In general, the controller 108 is responsible for converting commandpackets received from the host 102, e.g., from a PCIe bus, into commandinstructions for host-memory translation circuitry and for convertingmemory responses into host system commands for transmission to therequesting host.

In one or more embodiments, data can be written to the memory devicesone page at a time. Each page in the memory device can have a number ofphysical sectors and each physical sector can be associated with alogical block address (LBA). As an example, a physical page can have 8physical sectors of data. However, embodiments are not limited to aparticular number of physical sectors per physical page.

FIG. 2 is a schematic of a portion of memory 210 comprising an array ofmemory cells operable in accordance with a number of embodiments of thepresent disclosure. The embodiment of FIG. 2 illustrates a NANDarchitecture non-volatile memory array; however, embodiments describedherein are not limited to this example. For example, a number ofembodiments can implemented to a NOR architecture non-volatile memoryarray. As shown in FIG. 2, the memory array includes access lines (e.g.,word lines 205-1, . . . , 205-N) and intersecting data lines (e.g.,local bit lines 207-1, 207-2, 207-3, . . . , 207-M). For ease ofaddressing in the digital environment, the number of word lines 205-1, .. . , 205-N and the number of local bit lines 207-1, 207-2, 207-3, . . ., 207-M can be some power of two (e.g., 256 word lines by 4,096 bitlines).

The memory array includes NAND strings 209-1, 209-2, 209-3, . . . ,209-M. Each NAND string includes non-volatile memory cells 211-1, . . ., 211-N, each communicatively coupled to a respective word line 205-1, .. . , 205-N. Each NAND string (and its constituent memory cells) is alsoassociated with a local bit line 207-1, 207-2, 207-3, . . . , 207-M. Thememory cells 211-1, . . . , 211-N of each NAND string 209-1, 209-2,209-3, . . . , 209-M are coupled in series source to drain between aselect gate source (e.g., a field-effect transistor (FET) 213) and aselect gate drain (e.g., FET 219). Each select gate source 213 isconfigured to selectively couple a respective NAND string to a commonsource 223 responsive to a signal on source select line 217, while eachselect gate drain 219 is configured to selectively couple a respectiveNAND string to a respective bit line responsive to a signal on drainselect line 215.

As shown in the embodiment illustrated in FIG. 2, a source of selectgate source 213 is coupled to a common source line 223. The drain ofselect gate source 213 is coupled to the source of the memory cell 211-1of the corresponding NAND string 209-1. The drain of select gate drain219 is coupled to bit line 207-1 of the corresponding NAND string 209-1at drain contact 221-1. The source of select gate drain 219 is coupledto the drain of the last memory cell 211-N (e.g., a floating-gatetransistor) of the corresponding NAND string 209-1.

In a number of embodiments, construction of the non-volatile memorycells 211-1, . . . , 211-N includes a source, a drain, a floating gateor other charge storage structure, and a control gate. The memory cells211-1, . . . , 211-N have their control gates coupled to a word line,205-1, . . . , 205-N, respectively. A NOR array architecture would besimilarly laid out, except that the string of memory cells would becoupled in parallel between the select gates. For example, one end ofeach memory cell (e.g., a memory cell 211-N as illustrated in FIG. 2)can be coupled to a bit line, and another end of the same memory cellcan be coupled to a source line that can be aligned in parallel with thebit line. Furthermore, a NOR architecture can provide for random accessto the memory cells in the array (e.g., as opposed to page-based accessas with a NAND architecture).

In operation, a number of memory cells coupled to a selected word line(e.g., 205-1, . . . , 205-N) can be written and/or read together as agroup. A group of memory cells written and/or read together can bereferred to as a page of cells (e.g., a physical page) and can store anumber of pages of data (e.g., logical pages). A number of memory cellscoupled to a particular word line and programmed together to respectivedata states can be referred to as a target page. A programming operationcan include applying a number of program pulses (e.g., 16V-20V), whichcorrespond to a particular programming algorithm that is being used toprogram the memory cell, to a selected word line in order to increasethe threshold voltage (Vt) of selected cells coupled to that selectedword line to a desired voltage level corresponding to a targeted datastate. In a number of embodiments, a particular programming algorithm,such as coarse, fine, and/or superfine, can use a number programmingpulses to program the memory cells to a desired state. A programmingalgorithm having more programming pulses can program memory cells totheir desired state with more accuracy than programming algorithms withfewer programming pulses, which can be useful to maintain read marginswhen memory cells are storing multiple bits of data and/or to reduce thebit error rate for the memory cells. Read operations can include sensinga voltage and/or current change of a bit line coupled to a selected cellin order to determine the state of the selected cell. The read operationcan include precharging a bit line and sensing the discharge when aselected cell begins to conduct. One type of read operation comprisesapplying a ramping read signal to a selected word line, and another typeof read operation comprises applying a plurality of discrete readsignals to the selected word line to determine the states of the cells.

FIGS. 3A-3C illustrate timing diagrams using configuration commands inaccordance with one or more embodiments of the present disclosure. FIG.3A illustrates a timing diagram using a number of configuration commandswhen performing a number of write operations. FIG. 3A includes aconfiguration command 341 (“41h”). The 41h command is a configurationcommand that places the memory device in a multilevel cell mode with 3bits per cell that programs memory cells using a coarse programmingalgorithm. Once the memory cell has been placed in the mode indicated bythe 41h command, a write command 380 (“80h”), can be issued, whichincludes an address phase 382 (“ADD”), and a data input phase 384(“DiN”). Once address phase 382 and data input phase 384 associated withwrite command 380 has been executed, a write command 390 (“10h”) can beissued causing a course programming algorithm 392 to be executed. Thecourse programming algorithm can be executed to program memory cellswith 3 bits per cell, as indicated by the configuration command 341. Thememory device can be in the ready state when issuing and executing theconfiguration command 341 and the write commands 380 and 390. In anumber of embodiments, the configuration command 341 does not use thecommand queue on a host and/or the memory device. The configurationcommand also does not include a data transfer phase that uses busbandwidth between a host and the memory system, which would cause thememory system to be in a busy state.

In FIG. 3A, another write command can be executed following the firstwrite command. A configuration command 342 (“42h”), can be issuedfollowing the course programming algorithm 392. The 42h command is aconfiguration command that places the memory device in a multilevel cellmode with 3 bits per cell that programs memory cells using a fineprogramming algorithm. Once the memory cell has been placed in the modeindicated by the 42h command, write command 380 (“80h”), can be issued,which includes an address phase 382 (“ADD”) and a data input phase 384(“DiN”). Once address phase 382 and data input phase 384 associated withwrite command 380 has been executed, a write command 390 can be issuedcausing a fine programming algorithm 394 to be executed. The fineprogramming algorithm can be executed to program memory cells with 3bits per cell, as indicated by configuration command 342.

In FIG. 3A, another write command can be executed following the secondwrite command. A configuration command 343 (“43h”), can be issuedfollowing the fine programming algorithm 394. The 43h command is aconfiguration command that places the memory device in a multilevel cellmode with 3 bits per cell that programs memory cells using a superfineprogramming algorithm. Once the memory cell has been placed in the modeindicated by the 43h command, write command 380 (“80h”), can be issued,which includes an address phase 382 (“ADD”) and a data input phase 384(“DiN”). Once address phase 382 and data input phase 384 associated withwrite command 380 has been executed, a write command 390 can be issuedcausing a superfine programming algorithm 396 to be executed. Thesuperfine programming algorithm can be executed to program memory cellswith 3 bits per cell, as indicated by configuration command 343.

FIG. 3B illustrates a timing diagram using a configuration command whenperforming a read operation. FIG. 3A includes a configuration command341 (“41h”). The 41h command is a configuration command that places thememory device in a multilevel cell mode with 3 bits per cell thatprograms memory cells using a coarse programming algorithm. Command 42hor 43h could have also been issued in this example because thosecommands also place the memory device in a multilevel cell state with 3bits per cell. Commands 41h, 42h, and 43h all configure the memorydevice in a multilevel cell state with 3 bits per cell, but each usedifferent programming algorithms. Since the example in FIG. 3B isdirected to a read operation, the programming algorithm indicated by theconfiguration command is not used and would not affect the readoperation.

Once the memory cell has been placed in the mode indicated by the 41hcommand, read command 370 (“00h”) can be issued, which includes anaddress phase 382 (“ADD”). Once address phase 382 has been executed, aread command 330 (“30h”) can be issued causing a read algorithm 398 tobe executed. The data output phase 385 (“Dout”) can follow the readalgorithm 398 to transfer the data read from the memory device to therequesting device (e.g., host 102). The memory device can be in theready state when issuing and executing the configuration command 341 andthe read commands 370 and 330. In a number of embodiments, execution ofthe configuration command 341is complete while the device is in a readystate (e.g., not a busy state) and does not use the command queue on ahost and/or the memory device. The configuration command also does notinclude a data transfer phase that uses bus bandwidth between a host andthe memory system.

FIG. 3C illustrates a timing diagram using a configuration command whenperforming an erase operation. FIG. 3A includes a configuration command341 (“41h”). The 41h command is a configuration command that places thememory device in a multilevel cell mode with 3 bits per cell thatprograms memory cells using a coarse programming algorithm. Similar tothe discussion above regarding the read operation example of FIG. 3B,command 42h or 43h could have also been issued in this example since theexample in FIG. 3C is directed to an erase operation and the programmingalgorithm indicated by the configuration command 41h, 42h, and 43h isnot used and would not affect the erase operation.

Once the memory cell has been placed in the mode indicated by the 41hcommand, erase command 360 (“60h”) can be issued, which includes anaddress phase 382 (“ADD”). Once address phase 382 associated with erasecommand 360 has been executed, erase command 386 (“D0h”) can be issuedcausing an erase algorithm to be executed, which erases the blockindicated by erase command 360. The memory device can be in the readystate while issuing and executing the configuration command 341 and theerase commands 360 and 386. In a number of embodiments, theconfiguration command 341 does not use the command queue on a hostand/or the memory device. The configuration command also does notinclude a data transfer phase that uses bus bandwidth between a host andthe memory system, which would cause the memory device to be in a busystate.

In a number of embodiments, each of the write commands 380 and 390, readcommands 370 and 330, and the erase commands 360 and 386 can includeinstructions to execute the command on a particular LUN. For example,once a configuration command (e.g., commands 341, 342, . . . , 347) hasbeen issued, a read, write, or erase command can be issued that includesinstructions to perform the command on a particular LUN of the memorydevice. Therefore, configuration commands can place the entire device ina particular configuration while the memory device is in a ready stateand does not include a data transfer on the bus between the host and thememory device and then read, write, and/or erase commands can beexecuted on particular LUNs of the memory device. When issuing read,write, and/or erase commands on particular LUNs of the memory device,the particular LUN may be polled to ensure that the LUN is in a readystate and can execute the read, write, and/or erase command. Also, aby-LUN command (“78h”) can be used to active a particular mode anddeactivate the remaining LUNs. A configuration command (e.g., commands341, 342, . . . , 347) can be then executed, followed by a read, write,and/or erase command to perform an operation on the LUN indicated by the78h command in the mode indicated by the configuration commands.

FIG. 4 is a table of a number of configuration commands in accordancewith a number of embodiments of the present disclosure. Configurationcommands can be issued and executed while a memory device is in a readystate, as opposed to set commands which when executed cause the memorydevice to be in a busy state, to enable the memory device to operate inparticular modes. In the example shown in FIG. 4, a number ofconfiguration commands 440, 441, 442, 443, 444, 445, and 446, can beused to cause a memory device to operate in particular modes. Each ofthe configuration commands 440, 441, 442, 443, 444, 445, and 446, caninclude a command name 438 and can be associated with a particular modethat can indicate the memory cell type 430, the number of bits per cellassociated with the memory cells 432, and/or a programming algorithm 436used to program the memory cell.

In the example shown in FIG. 4, command 440, indicated as 40h can causethe memory device to operate as single level cell (SLC) with 1 bit percell. Command 441, indicated as 41h, can cause the memory device operateas a multi-level cell (MLC) with 3 bits per cell and use a coarseprogramming algorithm to program the memory cells. Command 442,indicated as 42h, can cause the memory device operate as a multi-levelcell (MLC) with 3 bits per cell and use a fine programming algorithm toprogram the memory cells. Command 443, indicated as 43h, can cause thememory device operate as a multi-level cell (MLC) with 3 bits per celland use a superfine programming algorithm to program the memory cells.Command 444, indicated as 44h, can cause the memory device operate as amulti-level cell (MLC) with 2 bits per cell and use a coarse programmingalgorithm to program the memory cells. Command 445, indicated as 45h,can cause the memory device operate as a multi-level cell (MLC) with 2bits per cell and use a fine programming algorithm to program the memorycells. Command 446, indicated as 46h, can cause the memory deviceoperate as a multi-level cell (MLC) with 1 bit per cell.

Each of the configuration commands 440, 441, 442, 443, 444, 445, and 446can be issued and executed while the memory device is in a ready stateand the host and/or memory device do not use a command queue forexecution of the configuration commands, therefore there is not a datainput phase that would use bus bandwidth between a memory system and ahost. In previous approaches, a set feature and/or a multi-level blockinstruction was used to configure a memory device, which required thehost and/or memory device to use a command queue, transfer data on thebus between the memory device and the host, and execution of theinstructions caused the memory device to be in a busy state.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of various embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the various embodiments ofthe present disclosure includes other applications in which the abovestructures and methods are used. Therefore, the scope of variousembodiments of the present disclosure should be determined withreference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. An apparatus, comprising: an array of memory cells of a memory device; and a processing device coupled to the array of memory cells, the processing device configured to: execute a command, while the memory device is in a ready state, to configure the memory device to a particular mode, wherein the particular mode defines a particular programming algorithm.
 2. The apparatus of claim 1, wherein the processing device is configured to execute the command to configure the memory device to the particular mode by configuring the memory device to include a number of bits per cell.
 3. The apparatus of claim 1, wherein the processing device is configured to execute another command to perform an operation while the memory device in the particular mode.
 4. The apparatus of claim 1, wherein the processing device is configured to execute the command to configure the memory device to the particular mode by configuring the memory device to a single level cell mode.
 5. The apparatus of claim 1, wherein the processing device is configured to execute the command to configure the memory device to the particular mode by configuring the memory device to a multi-level cell mode.
 6. The apparatus of claim 1, wherein the processing device is configured to execute another command to configure the memory device to another mode different from the particular mode.
 7. The apparatus of claim 1, wherein the processing device is configured to execute another command to perform an operation on a first logical unit (LUN) of the memory device while the memory device is in the particular mode.
 8. An apparatus, comprising: an array of memory cells of a memory device; and a processing device coupled to the array of memory cells, the processing device configured to: receive a command including instructions to configure the memory device to a particular mode, wherein the particular mode defines a particular programming algorithm; and execute the command to configure the memory device to the particular mode while the memory device in a ready state.
 9. The apparatus of claim 8, wherein the processing device is configured to execute the command without transferring data on a data bus between the memory device and a host.
 10. The apparatus of claim 8, wherein the processing device is configured to execute another command to write data to the memory device.
 11. The apparatus of claim 8, wherein the processing device is configured to execute another command to read data from the memory device.
 12. The apparatus of claim 8, wherein the processing device is configured to execute another command to erase data from the memory device.
 13. A system, comprising: a host configured to send a first and a second command; and a memory device coupled to the host, wherein the memory device comprises: an array of memory cells; and a processing device coupled to the array of memory cells, wherein the processing device is configured to: execute the first command to configure the memory device to a particular mode while the memory device in a ready state, wherein the particular mode defines a particular programming algorithm; and execute the second command to perform while the memory device is in the particular mode.
 14. The system of claim 13, wherein the processing device is configured to execute a third command to configure the memory device to another mode different from the particular mode.
 15. The system of claim 13, wherein the particular mode defines a number of bits per cell.
 16. The system of claim 13, wherein the particular programming algorithm is selected from a group including a course programming algorithm, a fine programming algorithm, and a superfine programming algorithm.
 17. The system of claim 13, wherein the first command is not placed in a command queue for execution.
 18. The system of claim 13, wherein execution of the first command does not include a data transfer phase.
 19. The system of claim 13, wherein the second command is a read operation.
 20. The system of claim 13, wherein the second command is a write operation. 